Jorma Kivilahti: search on Z-Library

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1

Reliability of CSP Interconnections Under Mechanical Shock Loading Conditions

Mattila, Toni T., Marjamaki, Pekka, Kivilahti, Jorma K.

Journal:

IEEE Transactions on Components and Packaging Technologies

Year:

2006

Language:

english

File:

PDF, 2.51 MB

english, 2006

2

A novel impact test system for more efficient reliability testing

Jussi Hokka, Toni T. Mattila, Jue Li, Jarmo Teeri, Jorma. K. Kivilahti

Journal:

Microelectronics Reliability

Year:

2010

Language:

english

File:

PDF, 1.89 MB

english, 2010

3

Nucleation Kinetics and Solidification Temperatures of SnAgCu Interconnections During Reflow Process

Yu, Hao, Kivilahti, Jorma K.

Journal:

IEEE Transactions on Components and Packaging Technologies

Year:

2006

Language:

english

File:

PDF, 534 KB

english, 2006

4

On the implicit integration of rate-dependent inelastic constitutive models

Reijo Kouhia, Pekka Marjamäki, Jorma Kivilahti

Journal:

International Journal for Numerical Methods in Engineering

Year:

2005

Language:

english

File:

PDF, 343 KB

english, 2005

5

Evaluation of electrolessly deposited NiP integral resistors on flexible polyimide substrate

Tuomas F. Waris, Markus P.K. Turunen, Tomi Laurila, Jorma K. Kivilahti

Journal:

Microelectronics Reliability

Year:

2005

Language:

english

File:

PDF, 475 KB

english, 2005

6

[Microsystems] Interfacial Compatibility in Microelectronics || Interfacial Adhesion in Polymer Systems

Laurila, Tomi, Vuorinen, Vesa, Paulasto-Kröckel, Mervi, Turunen, Markus, Mattila, Toni T., Kivilahti, Jorma

Year:

2012

Language:

english

File:

PDF, 535 KB

english, 2012

7

Investigation of environmental reliability of optical polymer waveguides embedded on printed circuit boards

Marika P. Immonen, Mikko Karppinen, Jorma K. Kivilahti

Journal:

Microelectronics Reliability

Year:

2007

Language:

english

File:

PDF, 1.00 MB

english, 2007

8

Pull-off test in the assessment of adhesion at printed wiring board metallisation/epoxy interface

Markus P.K Turunen, Pekka Marjamäki, Matti Paajanen, Jouko Lahtinen, Jorma K Kivilahti

Journal:

Microelectronics Reliability

Year:

2004

Language:

english

File:

PDF, 604 KB

english, 2004

9

Effect of oxygen on the reactions in the Si/Ta/Cu metallization system

Laurila, Tomi, Zeng, Kejun, Kivilahti, Jorma K., Molarius, Jyriki, Suni, Ilkka

Journal:

Journal of Materials Research

Year:

2001

Language:

english

File:

PDF, 663 KB

english, 2001

10

Evaluation of the surface free energy of spin-coated photodefinable epoxy

Markus P. K. Turunen, Tomi Laurila, Jorma K. Kivilahti

Journal:

Journal of Polymer Science Part B: Polymer Physics

Year:

2002

Language:

english

File:

PDF, 242 KB

english, 2002

11

Reactive blending approach to modify spin-coated epoxy film: Part II. Crosslinking kinetics

Markus P. K. Turunen, Tomi Laurila, Jorma K. Kivilahti

Journal:

Journal of Applied Polymer Science

Year:

2006

Language:

english

File:

PDF, 106 KB

english, 2006

12

Solid-State Reactions between Cu(Ni) Alloys and Sn

Vesa Vuorinen, Tomi Laurila, Toni Mattila, Erkki Heikinheimo, Jorma K. Kivilahti

Journal:

Journal of Electronic Materials

Year:

2007

Language:

english

File:

PDF, 539 KB

english, 2007

13

Thermodynamic Evaluation of Solid-State Reactions in which a Volatile Product is Formed

Alexander A. Kodentsov, Jorma K. Kivilahti, Frans J. J. van Loo

Journal:

Monatshefte für Chemie - Chemical Monthly

Year:

2005

Language:

english

File:

PDF, 218 KB

english, 2005

14

SEM observations on stress corrosion cracking of commercially pure titanium in a topical fluoride solution

Mauno H.O. Könönen, Eeva T. Lavonius, Jorma K. Kivilahti

Journal:

Dental Materials

Year:

1995

Language:

english

File:

PDF, 670 KB

english, 1995

15

[IEEE 2005 55th Electronic Components and Technology Conference - Lake Buena Vista, FL, USA (31 May-3 June 2005)] Proceedings Electronic Components and Technology, 2005. ECTC '05. - Effects of the solder oxide layer on high frequency signal propagation in Pb-free interconnections

Burlacu, D., Luu Nguyen,, Jorma Kivilahti,

Year:

2005

Language:

english

File:

PDF, 999 KB

english, 2005

16

Reactive blending approach to modify spin-coated epoxy film: Part I. Synthesis and characterization of star-shaped poly(ϵ-caprolactone)

Markus P. K. Turunen, Tomi Laurila, Jorma K. Kivilahti

Journal:

Journal of Applied Polymer Science

Year:

2006

Language:

english

File:

PDF, 361 KB

english, 2006

17

On the lattice stability of titanium

Jorma Kivilahti

Journal:

Scripta Metallurgica

Year:

1987

Language:

english

File:

PDF, 381 KB

english, 1987

18

SPIE Proceedings [SPIE Integrated Optoelectronic Devices 2004 - San Jose, CA, United States (Monday 26 January 2004)] Photonics Packaging and Integration IV - Optical interconnect on printed wiring board

Karppinen, Mikko, Heyler, Randy A., Chen, Ray T., Makinen, Jukka-Tapani, Kataja, Kari, Tanskanen, Antti, Alajoki, Teemu, Karioja, Pentti, Immonen, Marika, Kivilahti, Jorma

Year:

2004

Language:

english

File:

PDF, 305 KB

english, 2004

19

Failure mechanism of Ta diffusion barrier between Cu and Si

Laurila, Tomi, Zeng, Kejun, Kivilahti, Jorma K., Molarius, Jyrki, Suni, Ilkka

Journal:

Journal of Applied Physics

Year:

2000

Language:

english

File:

PDF, 832 KB

english, 2000

20

[IEEE 2006 1st Electronic Systemintegration Technology Conference - Dresden, Germany (2006.09.5-2006.09.7)] 2006 1st Electronic Systemintegration Technology Conference - A Wireless Biosensing Device

K. Turunen, Markus, Herola, Erkka, Kivilahti, Jorma

Year:

2006

Language:

english

File:

PDF, 6.69 MB

english, 2006

21

Amorphous layer formation at the TaC/Cu interface in the Si/TaC/Cu metallization system

Laurila, Tomi, Zeng, Kejun, Kivilahti, Jorma K., Molarius, Jyrki, Suni, Ilkka

Journal:

Applied Physics Letters

Year:

2002

Language:

english

File:

PDF, 499 KB

english, 2002

22

Reliability of Tantalum Based Diffusion Barriers between Cu and Si

Laurila, Tomi, Zeng, Kejun, Seppälä, A., Molarius, Jyrki, Suni, Ilkka, Kivilahti, Jorma K.

Journal:

MRS Proceedings

Year:

2000

Language:

english

File:

PDF, 859 KB

english, 2000

23

[IEEE 2005 55th Electronic Components and Technology Conference - Lake Buena Vista, FL, USA (31 May-3 June 2005)] Proceedings Electronic Components and Technology, 2005. ECTC '05. - Drop test reliability of wafer level chip scale packages

Alajoki, M., Luu Nguyen,, Jorma Kivilahti,

Year:

2005

Language:

english

File:

PDF, 2.71 MB

english, 2005

24

Bacterial Adherence to Titanium Surface Coated with Human Serum Albumin

Kinnari, Teemu J, Peltonen, Lauri I, Kuusela, Pentti, Kivilahti, Jorma, K??n??nen, Mauno, Jero, Jussi

Journal:

Otology & Neurotology

Year:

2005

Language:

english

File:

PDF, 275 KB

english, 2005

25

A new under bump metallurgy for solder bump flip chip applications

Kulojärvi, Kari, Kivilahti, Jorma

Journal:

Microelectronics International

Year:

1998

Language:

english

File:

PDF, 65 KB

english, 1998

26

Evaluation of structural defects in brazed ceramic-to-metal joints with C-mode scanning acoustic microscopy

Kauppinen, Pentti, Kivilahti, Jorma

Journal:

NDT & E International

Year:

1991

Language:

english

File:

PDF, 907 KB

english, 1991

27

Effect of dissolution and intermetallic formation on the reliability of FC joints

Kulojärvi, Kari, Vuorinen, Vesa, Kivilahti, Jorma

Journal:

Microelectronics International

Year:

1998

Language:

english

File:

PDF, 121 KB

english, 1998

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